WebA small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), … WebThin Small Outline Packages (TSOP) are thin body size components; thickness is 1.0mm. TSOP packages have four sides and are rectangular. Type I TSOPs have the leads protruding from the width portion of the package. Lead counts range from 28 to 48. Package body size ranges from 8x11.8mm to 12x20mm. Type II TSOP are becoming obsolete.
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WebThe only advantage of a chip is you could remove it if you want but now days there isn't really any reason that I can see. So I destroyed one pad on PCB, so I won't get another chance to solder it again and do TSOP flash. I said it had risks - a softmod doesn't. http://04731.thepandp.com/list/dbec8/ imtranslator english to welsh
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